Responsible for developing wafer fabrication process, integration flows, and metrology tools for enabling novel devices to be fabricated.

Essential Functions/ Responsibilities:

• Engineering leadership over company technology development and implementation, including:
• Through glass via (TGV) fabrication and filling technologies
• Wafer-based fabrication processes to allow electrical, optical, and fluidic interconnects.

• Work with Sales and Marketing and customers to understand the devices and fabrication/integration processes that should be developed as part of the company technology roadmap.
• Collaborate with operations to understand process and production issues and bottleneck, to ensure future development efforts provide continuous improvement solutions.
• Work closely with other development/product groups that are incorporating GCT components in their products to ensure the GCT devices work in their applications and understand enabling technologies required to be developed to align with their product and technology roadmaps.
• Work jointly with Application Engineering to resolve product technical issues during and after customer design in.
  Grow and develop the engineering team.

Preferred Experience:

• Experience in wafer engineering, and wafer fabrication and engineering.
• Engineering Management experience.
• Expertise with Glass, Silicon, Semiconductor, or Hard drive wafer process development and integration, qualification and high-volume manufacturing strongly desired.

Please click the green APPLY button below and include your resume to start your application

https://photonicsgrp.com/team/brian-murray/