Photonics Packaging Engineer opening - CA

Reference Number: RJA - 14 May 2018 #4
Location: Bay Area, CA

I am currently looking for an experienced Electronics Packaging Engineer. Strong packaging design skills, thermal and mechanical FEA analysis experience, and the ability to define process requirements with a team of engineers are required. An MS or Ph.D. in EE or a related technical field is required. MUST be in the U.S. Also, MUST have prior industry experience of at least 3-5 years. Please contact me, and include your current resume, if your skillset matches these requirements. Thanks.

The Photonics Group

rasher@photonicsgrp.com